Short survey (PDF)

HGM-21

High speed, wire type sizing/polishing machine for diamond/PCD dies. Designed especially for die workshops with low to medium die throughputs, this highly flexible machine features 2 independent die workstations, controlled by an easy to program Simatic PLC.

Model HGM-21 is suitable to perform the fast sizing and polishing of cylindrical die bearings, rounding off/blending profiles in round ND/PCD dies.

Offering an outstanding cross over workrange potential and performance.

HGM-21 Work range:
Standard: 0.05 - 2 mm Ø (.002 - 0.79" Ø)
and considerably larger even with the following optional accessories:
Large Wire Kit: up to 4.5 mm Ø (.018" Ø)
Maxispindle Kit: up to 10.0 mm Ø (.40" Ø).

Upon request and optionally, model HGM-21 can also be supplied with an automatic wire feeding (AF) system. (ideal when working small die-bores up to abt. 0.50mmØ).

CGM-1 und CGM-1/AF

Single die working station wire-type sizing polishing machine for a limited die through-put of natural diamond, monodies and PCD dies in the rather smaller bore size range. Available in a standard execution or equipped with an automatic wire feeding (AF) device.

CGM-1 and AF Work range: 0.05 - 1.0 mm Ø (.002 - .04" Ø)

Specialist horizontal single work station wire-type sizing and polishing machine designed specifically for ultra-fine diamond wire drawing die bores.

Model UFW-1 is suitable for sizing and polishing of cylindrical die-bearings, rounding off/blending of profiles and even for polishing the drawing cones of such small bores.

Due to the horizontally designed UFW conception, critical vibrations - often upcoming when using vertical equipment - are largely excluded and the used diamond suspension can get used up extensively.

Apart from the standard UFW-1 unit, EDER offer also an advanced UFW model, allowing to adjust workangles easily, even when the machine´s cover has beenclosed entirely, during operation performed.

UFW-1 Work range: 0.01 - 0.30 mm Ø (.0004 - .012" Ø).