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| ADVANCED ULTRASONIC DIE WORKING MACHINES | ||||||||||||||||||||||||||||||||||||||||||
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USP-115 The semiautomatic USP-115 ultrasonic diamond/PCD die working machine range is ideal for processing dies with frequently changing die bore parameters. This advanced model has been designed for the duties profiling/repairing/enlarging and polishing of all conical die portions and combines great flexibility with high performance, also featuring an integrated precise needle grinding device. |
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Depending on the respective die-size workrange required, model USP-115 is available in three different versions, "UF / F / P" to process ultrafine-, medium- and large die bores, in the following ranges of application : USP-115/UF Workrange: 0.05 - ca. 3.0 mm Ø |
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| USP-TWIN
SEMIAUTOMATIC DUAL WORKSTATION ULTRASONIC MACHINE This advanced EDER-conception can be controlled by one single operator only and can handle both small and medium to large die bore sizes simultaneously. It offers two independent ultrasonic workstations, one for the smaller die bore-sizes (0.05-3.0 mm Ø = UF) and another one for the medium to large size range (1.0 – 8.0 mm Ø = F), releasing the die-workshop personnel considerably. Other arangements possible too (2xF or 2xUF). |
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